solder                 package:rpart                 R Documentation

_S_o_l_d_e_r_i_n_g _o_f _C_o_m_p_o_n_e_n_t_s _o_n _P_r_i_n_t_e_d-_C_i_r_c_u_i_t _B_o_a_r_d_s

_D_e_s_c_r_i_p_t_i_o_n:

     The 'solder' data frame has 720 rows and 6 columns, representing a
     balanced subset of a designed experiment varying 5 factors on the
     soldering of components on printed-circuit boards.

_U_s_a_g_e:

     data(solder)

_F_o_r_m_a_t:

     This data frame contains the following columns:

     '_O_p_e_n_i_n_g' a factor with levels 'L'  'M'  'S' indicating the amount
          of clearance around the mounting pad.

     '_S_o_l_d_e_r' a factor with levels 'Thick'  'Thin' giving the thickness
          of the solder used.

     '_M_a_s_k' a factor with levels 'A1.5'  'A3'  'B3'  'B6' indicating
          the type and thickness of mask used.

     '_P_a_d_T_y_p_e' a factor with levels 'D4'  'D6'  'D7'  'L4'  'L6'  'L7' 
          'L8'  'L9'  'W4'  'W9' giving the size and geometry of the
          mounting pad.

     '_P_a_n_e_l' '1:3' indicating the panel on a board being tested.

     '_s_k_i_p_s' a numeric vector giving the number of visible solder
          skips.

_S_o_u_r_c_e:

     John M. Chambers and Trevor J. Hastie eds. (1992) _Statistical
     Models in S_, Wadsworth and Brooks/Cole, Pacific Grove, CA 1992.

_E_x_a_m_p_l_e_s:

     data(solder)
     fit <- rpart(skips ~ Opening + Solder + Mask + PadType + Panel,
            data=solder, method='anova')
     summary(residuals(fit))
     plot(predict(fit),residuals(fit))

